From small number of test grinidng to large number of lot process, please feel free to ask us.
We provide the grinding service using our wafer edge grinding machine with the highly accurate grinding technology.
Our wafer edge grinding machine is used for various materials such as silicon, sapphire, compound materials and glass.
Evaluation of Wafer
Also, we have measuring instruments that are developed by our metrology division and other industry standard measuring systems, and we can measure your wafers for your evaluation.
We believe that it is useful for your development or production.